Display device

ABSTRACT

A display device includes a first substrate including a display area and a non-display area, which is on the periphery of the display area, a light-emitting element disposed on the first substrate and in the display area, a display signal line which is disposed on the first substrate and in the display area, extends in a first direction, and transmits a signal to the light-emitting element, a common voltage supply line disposed on the first substrate and in the non-display area, a pad disposed on the first substrate and in the non-display area, and electrically connected to the display signal line, and an indentation pad disposed on the first substrate and in the non-display area, and electrically connected to the common voltage supply line, where the indentation pad is disposed closer than the pad to edges of the first substrate in a second direction, which intersects the first direction.

This application is a continuation of U.S. patent application Ser. No.16/743,965, filed on Jan. 15, 2020, which claims priority to KoreanPatent Application No. 10-2019-0011065, filed on Jan. 29, 2019, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention relate to a display device.

2. Description of the Related Art

A display device visually displays data. Examples of the display deviceinclude a liquid crystal display (“LCD”) device and an organiclight-emitting diode (“OLED”) display device. The OLED display devicehas excellent luminance and viewing angle characteristics, as comparedto the LCD device, and can be implemented as an ultrathin display devicebecause the OLED display device does not need a backlight module.

The display device may include a display area in which images aredisplayed and a non-display area which is disposed on the periphery ofthe display area, and wires may be provided in the non-display area.

SUMMARY

A non-display area, which is adjacent to edges of a display device, issusceptible to static electricity. Thus, when strong static electricityis introduced into the display device, wires of the display device maybe damaged by the static electricity.

Exemplary embodiments of the invention provide a display device withimproved reliability.

However, the invention is not restricted to those set forth herein. Theabove and other exemplary embodiments of the invention will become moreapparent to one of ordinary skill in the art to which the inventionpertains by referencing the detailed description of the invention givenbelow.

An exemplary embodiment of a display device includes a first substrateincluding a display area and a non-display area, which is on a peripheryof the display area, a light-emitting element disposed on the firstsubstrate and in the display area, a display signal line which isdisposed on the first substrate and in the display area, extends in afirst direction, and transmits a signal to the light-emitting element, acommon voltage supply line disposed on the first substrate and in thenon-display area, a pad disposed on the first substrate and in thenon-display area, and electrically connected to the display signal line,and an indentation pad disposed on the first substrate and in thenon-display area, and electrically connected to the common voltagesupply line, where the indentation pad is disposed closer than the padto edges of the first substrate in a second direction, which intersectsthe first direction.

An exemplary embodiment of a display device includes a substrateincluding a display area and a non-display area, which is on a peripheryof the display area, a light-emitting element disposed on the substrateand in the display area, a display signal line which is disposed on thesubstrate and in the display area, extends in a first direction, andtransmits a signal to the light-emitting element, a common voltagesupply line disposed on the substrate and in the non-display area, afirst pad disposed on the substrate and in the non-display area, andelectrically connected to the display signal line, and an alignment paddisposed on the substrate and in the non-display area, and electricallyconnected to the common voltage supply line, where the alignment padincludes a first pad portion extending in a second direction, whichintersects the first direction, and a second pad portion directlyconnected to the first pad portion and extending in the first direction.

According to the aforementioned and other exemplary embodiments of theinvention, a display device with improved reliability may be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary embodiments and features of the inventionwill become more apparent by describing in detail embodiments thereofwith reference to the attached drawings, in which:

FIG. 1 is a perspective view of an exemplary embodiment of a displaydevice according to the invention;

FIG. 2 is a cross-sectional view taken along line X1-X1′ of FIG. 1;

FIG. 3 is a cross-sectional view taken along line X3-X3′ of FIG. 1;

FIG. 4 is a plan view illustrating a display panel of the display deviceof FIG. 1 and a part of a flexible printed circuit board (“FPCB”)coupled to the display panel;

FIG. 5 is an equivalent circuit diagram illustrating a pixel of FIG. 4;

FIG. 6 is a cross-sectional view illustrating the pixel of FIG. 4;

FIG. 7 is a cross-sectional view taken along line X5-X5′ of FIG. 4;

FIG. 8 is an enlarged plan view illustrating a part Q1 of FIG. 4;

FIG. 9 is a cross-sectional view taken along line X7-X7′ of FIG. 8;

FIG. 10 is a cross-sectional view taken along line X9-X9′ of FIG. 8;

FIG. 11 is a cross-sectional view taken along line X11-X11′ of FIG. 8;

FIG. 12 is a schematic view illustrating how to align a seventh pad anda seventh terminal of FIG. 5;

FIG. 13 is a schematic view illustrating the path of movement of staticelectricity introduced from the outside of the display device of FIG. 1in the structure illustrated in FIG. 8;

FIG. 14 is a plan view illustrating a touch sensing layer of the displaydevice of FIG. 1;

FIG. 15 is an enlarged plan view of a part Q3 of FIG. 14;

FIG. 16 is a cross-sectional view, taken along line X13-X13′ of FIG. 15,of the touch sensing layer;

FIG. 17 is a cross-sectional view, taken along line X15-X15′ of FIG. 15,of the touch sensing layer;

FIG. 18 is a plan view illustrating a part Q5 of FIG. 14 to show thepath of movement of static electricity introduced from the outside ofthe display device of FIG. 1;

FIG. 19 is a cross-sectional view, taken along line X17-X17′ of FIG. 18,of the touch sensing layer;

FIG. 20 is a plan view illustrating a modified example of the part Q5 ofFIG. 18; and

FIG. 21 is a plan view illustrating another modified example of the partQ5 of FIG. 18.

DETAILED DESCRIPTION

Features of the invention and methods of accomplishing the same may beunderstood more readily by reference to the following detaileddescription of embodiments and the accompanying drawings. The inventionmay, however, be embodied in many different forms and should not beconstrued as being limited to the exemplary embodiments set forthherein. Rather, these embodiments are provided so that this inventionwill be thorough and complete and will fully convey the concept of theinvention to those skilled in the art, and the invention will only bedefined by the appended claims. Like reference numerals refer to likeelements throughout the specification.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on”, “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the invention.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Exemplary embodiments of the inventive subject matter are describedherein with reference to plan and perspective illustrations that areschematic illustrations of idealized exemplary embodiments of theinventive subject matter. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Therefore, the exemplaryembodiments of the invention is not limited to specific features but mayinclude variations depending on the fabricating processes. Therefore,the regions illustrated in the drawings have schematic attributes, andthe shapes of the regions illustrated in the drawings are forillustrating specific shapes and are not for limiting the scope of theinvention.

In the accompanying drawings, like reference numerals indicate likeelements.

Exemplary embodiments of the invention will hereinafter be describedwith reference to the accompanying drawings.

FIG. 1 is a perspective view of an exemplary embodiment of a displaydevice according to the invention, FIG. 2 is a cross-sectional viewtaken along line X1-X1′ of FIG. 1, and FIG. 3 is a cross-sectional viewtaken along line X3-X3′ of FIG. 1.

Referring to FIGS. 1 through 3, a display device 1 may include a displaypanel DP, a touch sensing layer 300 disposed on the display panel DP,and a flexible printed circuit board (“FPCB”) 500 connected to thedisplay panel DP. The display device 1 may further include a touch FPCB700 connected to the touch sensing layer 300.

In some exemplary embodiments, the display panel DP may have arectangular shape in a plan view. The display panel DP may include apair of long sides extending in a first direction x and a pair of shortsides extending in a second direction y, which intersects the firstdirection x. The corners at which the long sides and the short sides ofthe display panel DP meet may be right-angled, but the invention is notlimited thereto. In an alternative exemplary embodiment, the corners atwhich the long sides and the short sides of the display panel DP meetmay be rounded or may be chamfered to reduce the risk of breakage.However, the planar shape of the display panel DP is not particularlylimited, and the display panel DP may have a shape other than arectangular shape, such as a circular shape, in a plan view.

In a plan view, the display panel DP may include a display area DA and anon-display area NDA. The display area DA is an area in which images aredisplayed, and the non-display area NDA is an area in which no imagesare displayed. In some exemplary embodiments, the non-display area NDAmay be disposed on the periphery of the display area DA and may surroundthe display area DA.

Unless specified otherwise, the terms “on”, “upper”, “above”, and “top”,as used herein, refer to a third direction z, which intersects the firstand second directions x and y, and the terms “below”, “lower”, “under”,and “bottom”, as used herein, refer to the direction opposite to thethird direction z.

In some exemplary embodiments, the display panel DP may be a rigiddisplay panel or a flexible display panel.

In some exemplary embodiments, the display panel DP may be a displaypanel including self-luminous elements. Examples of the self-luminouselements may include organic light-emitting diodes (“OLEDs”),quantum-dot light-emitting diodes (“QLEDs”), inorganic microlight-emitting diodes (‘mLEDs”), and inorganic nano-light-emittingdiodes (“nano-LEDs”). For convenience, the self-luminous elements willhereinafter be described as being, for example, OLEDs.

The display panel DP includes a first substrate 110, a second substrate210 disposed on the first substrate 110, an element layer disposedbetween the first and second substrates 110 and 210, and a pad portionPD disposed on the first substrate 110. The display panel DP may furtherinclude a sealing member S, which is disposed between the first andsecond substrates 110 and 210 along the sides of each of the first andsecond substrates 110 and 210 and couples the first and secondsubstrates 110 and 210.

The first substrate 110 is a substrate supporting the element layer andthe pad portion PD. In some exemplary embodiments, the first substrate110 may be an insulating substrate including glass, quartz, ceramic, orplastic.

The element layer is disposed on the first substrate 110. In someexemplary embodiments, the element layer may include a plurality ofpixels and a plurality of display signal lines which are disposed on thefirst substrate 110 and are located in the display area DA. Each of thepixels may include a thin-film transistor (“TFT”), a capacitor, and alight-emitting element. The display signal lines may include scan linestransmitting scan signals to the pixels and data lines transmitting datasignals to the pixels.

The element layer may further include elements and wires which aredisposed on the first substrate 110 and are located in the non-displayarea NDA. The elements and the wires may generate various signals thatare to be applied to the pixels or may transmit the generated signals tothe pixels.

The pad portion PD may be disposed on the first substrate 110 and may belocated in the non-display area NDA. The pad portion PD may be disposedon one side of the display device 1, but the invention is not limitedthereto. The pad portion PD may be connected to the FPCB 500, whichtransmits signals and voltages from the outside of the display device 1.

The second substrate 210 may be an encapsulation substrate preventingexternal moisture and/or oxygen from infiltrating into the display areaDA. The second substrate 210 may be provided as a polymer film usingglass or plastic. The second substrate 210 may have a smaller size thanthat of the first substrate 110 and may cover the first substrate 110and the pixels disposed in the display area DA. In some exemplaryembodiments, the second substrate 210 may not overlap with the padportion PD. That is, the length, in the first direction x, of the secondsubstrate 210 may be smaller than the length, in the first direction x,of the first substrate 110.

The sealing member S may be disposed between the first and secondsubstrates 110 and 210. The sealing member S may be located in thenon-display area NDA and may be disposed to completely surround thedisplay area DA in a plan view. The sealing member S may bond the firstand second substrates 110 and 210 together and may prevent externalimpurities such as moisture or oxygen from infiltrating between thefirst and second substrates 110 and 210. In some exemplary embodiments,the sealing member S may be provided by providing a sealing materialsuch as glass frit between the first and second substrates 110 and 210and applying laser light to the sealing material to melt the sealingmaterial.

The touch sensing layer 300 may be disposed on the display panel DP. Insome exemplary embodiments, the touch sensing layer 300 may acquire thecoordinates of a touch input location in a capacitive manner.Specifically, the touch sensing layer 300 may acquire coordinateinformation of a touch point in a self-capacitance manner or a mutualcapacitance manner. For convenience, the touch sensing layer 300 willhereinafter be described as being of, for example, a mutual capacitancetype, but the invention is not limited thereto.

In some exemplary embodiments, the touch sensing layer 300 may bedisposed on the display panel DP, particularly, on the second substrate210.

In some exemplary embodiments, a part of the touch sensing layer 300disposed in the display area DA may include touch electrodes (notillustrated), and a part of the touch sensing layer 300 disposed in thenon-display area NDA may include touch signal lines (not illustrated)transmitting signals to and/or receiving signals from the touchelectrodes and a touch pad portion TPAD connected to the touch signallines.

In some exemplary embodiments, the touch electrodes, the touch signallines, and the touch pad portion TPAD of the touch sensing layer 300 maybe disposed on the second substrate 210. In other words, a bonding layer(e.g., an adhesive layer) may not be disposed between the touch sensinglayer 300 and the second substrate 210. In an exemplary embodiment, atleast one of the touch electrodes, the touch signal lines, and the touchpad portion TPAD of the touch sensing layer 300 may be disposed directlyon the second substrate 210, for e, for example. In an alternativeexemplary embodiment, in a case where an insulating film is providedbetween the touch sensing layer 300 and the second substrate 210, atleast one of the touch electrodes, the touch signal lines, and the touchpad portion TPAD of the touch sensing layer 300 may be disposed directlyon the insulating film.

The FPCB 500 may be connected to the display panel DP. In some exemplaryembodiments, the FPCB 500 may include a terminal portion CDcorresponding to the pad portion PD, and the terminal portion CD of theFPCB 500 may be electrically connected to the pad portion PD.

The FPCB 500 may be bent to face the bottom surface of the display panelDP or the bottom surface of the first substrate 110, and a part of theFPCB 500 facing the bottom surface of the display panel DP may be fixedto the bottom surface of the display panel DP or the bottom surface ofthe first substrate 110.

In some exemplary embodiments, the part of the FPCB 500 facing thebottom surface of the display panel DP may be fixed to the bottomsurface of the display panel DP or the bottom surface of the firstsubstrate 110 via a coupling member 900. The coupling member 900 mayinclude a conductive material. In an exemplary embodiment, the couplingmember 900 may be provided as a double-sided tape including a copper(Cu) layer, for example. In a case where the coupling member 900includes a conductive material, static electricity introduced into theFPCB 500 may be dispersed to the coupling member 900. As a result,static electricity may be prevented from being introduced into thedisplay panel DP, or the amount of static electricity introduced intothe display panel DP may be reduced.

In some exemplary embodiments, the part of the FPCB 500 facing thebottom surface of the display panel DP may partially overlap with thedisplay area DA. Since the FPCB 500 is bent down toward the bottom ofthe display panel DP, the bezel size of the display device 1 may bereduced.

In some exemplary embodiments, a driver D-IC may be disposed (e.g.,mounted) on the FPCB 500 as an integrated circuit (“IC”) chip. Thedriver D-IC may output driving power and driving signals, and thedriving signals may be provided to the pixels of the display panel DPvia the terminal portion CD of the FPCB 500 and the pad portion PD ofthe display panel DP. In some exemplary embodiments, the driver D-IC maybe a data driving circuit providing data signals to the pixels in thedisplay area DA. In some exemplary embodiments, the driver D-IC mayoverlap with the display area DA, but the invention is not limitedthereto.

In some exemplary embodiments, an anisotropic conductive film AD1 may bedisposed between the pad portion PD and the terminal portion CD of theFPCB 500, and the pad portion PD and the terminal portion CD may bephysically and/or electrically coupled to each other via the anisotropicconductive film AD1. The anisotropic conductive film AD1, which is anadhesive film for connecting circuits, may have anisotropic propertiesthat exhibit conductivity in one direction (e.g., in a thicknessdirection) and dielectricity in another direction (e.g., in a surfacedirection). The anisotropic conductive film AD1 includes an insulatinglayer having adhesiveness (e.g., a thermosetting insulating layer) and aplurality of conductive balls disposed in the insulating layer.

In some exemplary embodiments, a connecting portion CT may be furtherdisposed on the FPCB 500. The connecting portion CT may be connected tothe touch FPCB 700. In some exemplary embodiments, the connectingportion CT may be provided as a connector.

The touch FPCB 700 may be connected to the touch sensing layer 300. Insome exemplary embodiments, the touch FPCB 700 may include a touchterminal portion TCD corresponding to the touch pad portion TPAD, andthe touch terminal portion TCD may be electrically connected to thetouch pad portion TPAD.

In some exemplary embodiments, an anisotropic conductive film AD2 may bedisposed between the touch pad portion TPAD of the touch FPCB 700 andthe touch terminal portion TCD of the touch sensing layer 300, and thetouch terminal portion TCD and the touch pad portion TPAD may bephysically and/or electrically connected via the anisotropic conductivefilm AD2.

In some exemplary embodiments, the touch FPCB 700 may be bent toward thebottom surface of the display panel DP or the bottom surface of thefirst substrate 110 and may be connected to the connecting portion CT,which is provided on the FPCB 500, at the bottom of the display panelDP.

In some exemplary embodiments, a part of the touch FPCB 700 disposedbelow the display panel DP may partially overlap with the display areaDA.

In some exemplary embodiments, a touch driver T-IC may be disposed(e.g., mounted) on the touch FPCB 700 as an IC chip. The touch driverT-IC may output touch driving signals, and the touch driving signals maybe provided to the touch electrodes of the touch sensing layer 300 viathe touch terminal portion TCD and the touch pad portion TPAD of thetouch FPCB 700. The touch driver T-IC may receive touch sensing signalsfrom the touch sensing layer 300 and may generate touch information suchas information regarding the presence of touch input and the location ofthe touch input by processing the touch sensing signals. In someexemplary embodiments, the touch driver T-IC may overlap with thedisplay area DA, but the invention is not limited thereto.

The display panel DP will hereinafter be described with reference toFIGS. 4 through 13.

FIG. 4 is a plan view illustrating the display panel of the displaydevice of FIG. 1 and a part of the FPCB coupled to the display panel,FIG. 5 is an equivalent circuit diagram illustrating a pixel of FIG. 4,FIG. 6 is a cross-sectional view illustrating the pixel of FIG. 4, FIG.7 is a cross-sectional view taken along line X5-X5′ of FIG. 4, FIG. 8 isan enlarged plan view illustrating a part Q1 of FIG. 4, FIG. 9 is across-sectional view taken along line X7-X7′ of FIG. 8, FIG. 10 is across-sectional view taken along line X9-X9′ of FIG. 8, FIG. 11 is across-sectional view taken along line X11-X11′ of FIG. 8, FIG. 12 is aschematic view illustrating how to align a seventh pad and a seventhterminal of FIG. 5, and FIG. 13 is a schematic view illustrating thepath of movement of static electricity introduced from the outside ofthe display device of FIG. 1 in the structure illustrated in FIG. 8.

Referring to FIGS. 4 through 13, the display panel DP includes thedisplay area DA and the non-display area NDA, which is disposed on theperiphery of the display area DA.

As illustrated in FIG. 4, in the display area DA, scan lines GL, datalines DL, power lines PL, and a plurality of pixels PX may be disposedon the first substrate 110.

In the non-display area NDA, the pad portion PD, driving circuits GDC, acommon voltage supply line ESL, a driving voltage supply line EDL,connecting lines (11, 12, 13, 14, 15, and 16), and the sealing member S,which surrounds the display area DA, may be disposed on the firstsubstrate 110.

The scan lines GL are connected to the plurality of pixels PX totransmit scan signals to the plurality of pixels PX.

The data lines DL are connected to the plurality of pixels PX totransmit data signals to the plurality of pixels PX.

The power lines PL are connected to the plurality of pixels PX toprovide driving voltages to the plurality of pixels PX.

In some exemplary embodiments, the scan lines GL may extend in thesecond direction y, and the data lines DL may extend in the firstdirection x. In some exemplary embodiments, the power lines PL mayextend in the same direction as the data lines DL, i.e., in the firstdirection x, but the invention is not limited thereto.

FIG. 5 illustrates one scan line GL, one data line DL, one power linePL, and a pixel PX connected to the scan line GL, the data line DL, andthe power line PL. The structure of the plurality of pixels PX of FIG.4, however, is not particularly limited, but may vary.

Referring to FIG. 5, an OLED may be a top emission OLED or a bottomemission OLED. The pixel PX of FIG. 5 includes a first transistor (alsoreferred to as “a switching transistor”) T1, a second transistor (alsoreferred to as “a driving transistor”) T2, and a capacitor Cst as pixeldriving circuitry for driving the OLED. A first power supply voltageELVDD is provided to the second transistor T2, and a second power supplyvoltage ELVSS is provided to the OLED. The second power supply voltageELVSS may be lower than the first power supply voltage ELVDD.

The first transistor T1 outputs a data signal applied to the data lineDL to which the pixel PX of FIG. 5 is connected in response to a scansignal applied to the scan line GL to which the pixel PX of FIG. 5 isconnected. The capacitor Cst is charged with a voltage corresponding tothe data signal output by the first transistor T1. The second transistorT2 is connected to the OLED. The second transistor T2 controls a drivingcurrent flowing in the OLED in accordance with the amount of chargestored in the capacitor Cst.

The structure of the pixel PX of FIG. 5 is merely exemplary, and theinvention is not limited thereto. The pixel PX of FIG. 5 may includemore than two transistors and more than one capacitor. The OLED may beconnected between the second transistor T2 and the power line PL towhich the pixel PX of FIG. 5 is connected.

FIG. 6 illustrates a part of the display panel DP corresponding to thepixel PX of FIG. 5.

Referring to FIG. 6, a buffer film BFL may be disposed on the firstsubstrate 110.

A first semiconductor pattern OSP1 of the first transistor T1 and asecond semiconductor pattern OSP2 of the second transistor T2 may bedisposed on the buffer film BFL. The first and second semiconductorpatterns OSP1 and OSP2 may include a material selected from amongamorphous silicon, polysilicon, and a metal oxide semiconductor. In someexemplary embodiments, one of the first and second semiconductorpatterns OSP1 and OSP2 may include polysilicon, and the othersemiconductor pattern may include a metal oxide semiconductor.

A first interlayer inorganic film 111 may be disposed on the first andsecond semiconductor patterns OSP1 and OSP2. A first control electrodeGE1 of the first transistor T1 and a second control electrode GE2 of thesecond transistor T2 may be disposed on the first interlayer inorganicfilm (also referred to as “first interlayer insulating film”) 111. In acase where the first and second control electrodes GE1 and GE2 aredisposed in the same layer, the first and second control electrodes GE1and GE2 may be fabricated by the same photolithography process as thescan lines GL of FIG. 4, but the invention is not limited thereto. Thefirst and second control electrodes GE1 and GE2 may be disposed indifferent layers, in which case, only one of the first and secondcontrol electrodes GE1 and GE2 may be fabricated by the samephotolithography process as the scan lines GL of FIG. 4.

A second interlayer insulating film 112, which covers the first andsecond control electrodes GE1 and GE2, may be disposed on the firstinterlayer insulating film 111. A first input electrode DE1 and a firstoutput electrode SE1 of the first transistor T1 and a second inputelectrode DE2 and a second output electrode SE2 of the second transistorT2 may be disposed on the second interlayer insulating film 112.

The first input electrode DE1 and the first output electrode SE1 may beconnected to the first semiconductor pattern OSP1 through first andsecond through holes CH1 and CH2, respectively, that penetrate the firstand second interlayer insulating films 111 and 112. The second inputelectrode DE2 and the second output electrode SE2 may be connected tothe second semiconductor pattern OSP2 through third and fourth throughholes CH3 and CH4, respectively, that penetrate the first and secondinterlayer insulating films 111 and 112. In some exemplary embodiments,at least one of the first and second transistors T1 and T2 may have abottom gate structure.

A middle organic film 113, which covers the first input electrode DE1,the second input electrode DE2, the first output electrode SE1, and thesecond output electrode SE2, may be disposed on the second interlayerinsulating film 112. The middle organic film 113 may provide a flatsurface.

A pixel defining film PDL and the OLED may be disposed on the middleorganic film 113. The pixel defining film PDL may include an organicmaterial. A first electrode AE may be disposed on the middle organicfilm 113. The first electrode AE is connected to the second outputelectrode SE2 through a fifth through hole CH5 that penetrates themiddle organic film 113. An opening OPN is defined on the pixel definingfilm PDL. The opening OPN of the pixel defining film PDL exposes atleast part of the first electrode AE. In another exemplary embodiment,the pixel defining film PDL may not be provided.

The pixel PX of FIG. 5 may be disposed in the display area DA. Thedisplay area DA may include a light-emitting area PXA and anon-light-emitting area NPXA, which is adjacent to the light-emittingarea PXA. The non-light-emitting area NPXA may surround thelight-emitting area PXA. The light-emitting area PXA is defined tocorrespond to the part of the first electrode AE exposed by the openingOPN.

The light-emitting are PXA may overlap with at least one of the firstand second transistors T1 and T2. The opening OPN may become wider, andthe first electrode AE and a light-emitting layer EML, which will bedescribed later, may also become wider.

A hole control layer HCL may be disposed in both the light-emitting areaPXA and the non-light-emitting area NPXA. Although not specificallyillustrated, a common layer such as the hole control layer HCL may beprovided in common in all the plurality of pixels PX of FIG. 4.

The light-emitting layer EML is disposed on the hole control layer HCL.The light-emitting layer EML may be disposed in an area corresponding tothe opening OPN. That is, the light-emitting layer EML may be providedin the pixel PX of FIG. 5 as a separate pattern from light-emittinglayers EML provided in other pixels PX. The light-emitting layer EML mayinclude an organic material and/or an inorganic material. Thelight-emitting layer EML may generate color light of a predeterminedcolor.

The light-emitting layer EML is illustrated as being a patterned layer,but the invention is not limited thereto. In an alternative exemplaryembodiment, the light-emitting layer EML may be a non-patterned commonlayer provided in common in all the plurality of pixels PX, in whichcase, the light-emitting layer EML may generate white light, forexample. In an alternative exemplary embodiment, the light-emittinglayer EML may have a multilayer structure referred to as a tandem.

An electron control layer ECL is disposed on the light-emitting layerEML. Although not specifically illustrated, the electron control layerECL may be provided in common in all the plurality of pixels PX of FIG.4. The second electrode CE is disposed on the electron control layerECL. The second electrode CE is disposed in common in all the pluralityof pixels PX.

The second substrate 210 may be disposed on the second electrode CE, andthe second electrode CE and the second substrate 210 may be spaced apartfrom each other. The touch sensing layer 300 may be disposed on thesecond substrate 210.

As illustrated in FIG. 4, the driving circuits GDC may be disposed onthe left or right side of the display area DA. FIG. 4 illustrates thattwo driving circuits GDC are provided and are disposed on both the leftand right sides of the display area DA, but the invention is not limitedthereto. In an alternative exemplary embodiment, the driving circuitsGDC may be disposed on only one side of the display area DA.

The driving circuits GDC may include a scan driving circuit. The drivingcircuits GDC may be connected to the scan lines GL. The driving circuitsGDC may generate a plurality of scan signals and may sequentially outputthe scan signals to the scan lines GL. In some exemplary embodiments,the driving circuits GDC may include a plurality of thin filmtransistors (“TFTs”) provided by the same process as the drivingcircuits of the plurality of pixels PX, e.g., a low temperaturepolycrystalline silicon (“LTPS”) process or a low temperaturepolycrystalline oxide (“LTPO”) process, for example.

In the non-display area NDA, the driving circuits GDC may be disposed onthe first substrate 110. In some exemplary embodiments, the drivingcircuits GDC may be disposed on the left or right side of the displayarea DA. FIG. 4 illustrates that two driving circuits GDC are providedand are disposed on both the left and right sides of the display areaDA, but the invention is not limited thereto. In an alternativeexemplary embodiment, the driving circuits GDC may be disposed on onlyone side of the display area DA.

The driving voltage supply line EDL may be disposed in the non-displayarea NDA, particularly, between the pad portion PD and the display areaDA. The driving voltage supply line EDL may be connected to the powerlines PL, and driving voltages may be provided to the plurality ofpixels PX via the driving voltage supply line EDL and the power linesPL.

The common voltage supply line ESL is disposed in the non-display areaNDA and provides a common voltage to the second electrode CE of the OLEDof the pixel PX of FIG. 5. In some exemplary embodiments, the commonvoltage supply line ESL may extend along all edges ED of the firstsubstrate 110, except for the edge ED corresponding to the pad portionPD, in the form of a loop with one side opened.

In some exemplary embodiments, the common voltage supply line ESL may atleast partially overlap with the sealing member S. FIG. 4 illustratesthat the common voltage supply line ESL completely overlaps with thesealing member S, but the invention is not limited thereto. In analternative exemplary embodiment, at least part of the common voltagesupply line ESL may not overlap with the sealing member S.

In some exemplary embodiments, the common voltage supply line ESL andthe driving voltage supply line EDL may be disposed in the same layerand may include the same material. In some exemplary embodiments, thecommon voltage supply line ESL and the driving voltage supply line EDLmay include the same material as that of the first input electrode DE1and the first output electrode SE1 of FIG. 6 and may be disposed in thesame layer as the first input electrode DE1 and the first outputelectrode SE1 of FIG. 6.

The pad portion PD may be disposed in the non-display area NDA, and thepad portion PD and the display area DA may be disposed on opposite sidesof the driving voltage supply line EDL.

The pad portion PD may include first pads PD1, second pads PD2, thirdpads PD3, fourth pads PD4, fifth pads PD5, sixth pads PD6, and seventhpads PD7.

The first pads PD1 are electrically connected to the data lines DL, andthe data signals provided by the driver D-IC are provided to theplurality of pixels PX via the first pads PD1 and the data lines DL. Insome exemplary embodiments, a plurality of first pads PD1 may bearranged along the second direction y.

Second, third, fourth, fifth, sixth, and seventh pads PD2, PD3, PD4,PD5, PD6, and PD7 may be disposed on one side (e.g., on the left side)of each of the first pads PD1 along the second direction y. FIG. 4illustrates that second, third, fourth, fifth, sixth, and seventh padsPD2, PD3, PD4, PD5, PD6, and PD7 are sequentially arranged on one sideof each of the first pads PD1 along the second direction y, but theinvention is not limited thereto. The order of arrangement of the secondpads PD2, the third pads PD3, the fourth pads PD4, the fifth pads PD5,the sixth pads PD6, and the seventh pads PD7 may vary.

In some exemplary embodiments, second, third, fourth, fifth, sixth, andseventh pads PD2, PD3, PD4, PD5, PD6, and PD7 may be further disposed onthe other side (e.g., on the right side) of each of the first pads PD1along the second direction y.

The second pads PD2 are electrically connected to the driving voltagesupply line EDL, and driving voltages may be provided to the pluralityof pixels PX via the FPCB 500, the second pads PD2, the driving voltagesupply line EDL, and the power lines PL.

The third pads PD3 are electrically connected to the driving circuitsGDC. Control signals (e.g., a vertical synchronization signal, ahorizontal synchronization signal, a clock signal, and the like)generated by an external circuit connected to the FPCB 500 may beprovided to the driving circuits GDC via the FPCB 500 and the third padsPD3.

The fourth pads PD4 are electrically connected to the common voltagesupply line ESL. Driving voltages may be provided to the plurality ofpixels PX via the FPCB 500, the fourth pads PD4, and the common voltagesupply line ESL. In some exemplary embodiments, the fourth pads PD4 maybe disposed on one side of the second pads PD2 along the seconddirection y, but the invention is not limited thereto.

The fifth pads PD5 may be dummy pads. The fifth pads PD5 may be coupledto fifth terminals CD5 of the FPCB 500 and may improve the couplingforce between the FPCB 500 and the display panel DP.

The fifth pads PD5 may be disposed closer than the first pads PD1, thesecond pads PD2, the third pads PD3, and the fourth pads PD4 to theedges ED of the display panel DP in the second direction y.

In some exemplary embodiments, the fifth pads PD5 may be electricallyconnected to the common voltage supply line ESL.

The sixth pads PD6 may be indentation pads for inspecting indentations.

In some exemplary embodiments, each of the sixth pads PD6 may include alight-transmitting part OP. That is, each of the sixth pads PD6 mayinclude a light-transmitting part OP and a metal part surrounding thelight-transmitting part OP.

As illustrated in FIG. 7, the anisotropic conductive film AD1, whichcouples the FPCB 500 to the display panel DP, includes an insulatinglayer BR and a plurality of conductive balls CB disposed in theinsulating layer BR, and the pad portion PD and the terminal portion CDmay be electrically connected by the conductive balls CB. Thus, thenumber of conductive balls CB between the pads of the pad portion PD andthe terminals of the terminal portion CD is highly related to theconnection reliability between the pad portion PD and the terminalportion CD.

Since each of the sixth pads PD6 includes the light-transmitting partOP, the number of conductive balls CB between the sixth pads PD6 andsixth terminals CD6, which will be described later, may be easilyidentified, as viewed from the bottom to the top of the first substrate110, even when the FPCB 500 and the display panel DP are coupledtogether. Accordingly, the total number of conductive balls CB betweenthe pads of the pad portion PD and the terminals of the terminal portionCD may be estimated, and as a result, the connection reliability betweenthe FPCB 500 and the display panel DP may be identified.

In some exemplary embodiments, the sixth pads PD6, like the fifth padsPD5, may be electrically connected to the common voltage supply lineESL. The sixth pads PD6 may be disposed closer than the fifth pads PD5to the edges ED (e.g., the left and right edges) of the display panelDP.

The seventh pads PD7 may be alignment pads for aligning the displaypanel DP with other elements. In an exemplary embodiment, the seventhpads PD7 may be for aligning the FPCB 500 with the display panel DP andmay be aligned with seventh terminals CD7 of the FPCB 500, for example.

In some exemplary embodiments, the seventh pads PD7 may be electricallyconnected to the common voltage supply line ESL. The seventh pads PD7may be disposed closer than the sixth pads PD6 to the edges ED (e.g.,the left and right edges) of the display panel DP.

In some exemplary embodiments, the seventh pads PD7 may include firstpad portions PD7 a extending in the second direction y and second padportions PD7 b connected to the first pad portions PD7 a and extendingin the first direction x. The first pad portions PD7 a may be connecteddirectly to the sixth pads PD6, and the seventh pads PD7 may beelectrically connected to the common voltage supply line ESL via thesixth pads PD6.

In some exemplary embodiments, the first pads PD1, the second pads PD2,the third pads PD3, the fourth pads PD4, the fifth pads PD5, the sixthpads PD6, and the seventh pads PD7 may include the same material as thatof the first input electrode DE1 and the first output electrode SE1 ofFIG. 6 and may be disposed in the same layer as the first inputelectrode DE1 and the first output electrode SE1 of FIG. 6.

The connecting lines (11, 12, 13, 14, 15, and 16) may be disposed in thenon-display area NDA and may include first connecting lines 11, secondconnecting lines 12, third connecting lines 13, fourth connecting lines14, fifth connecting lines 15, and sixth connecting lines 16.

The first connecting lines 11 may be connected to the data lines D1 andthe first pads PD1, and the data lines DL and the first pads PD1 may beelectrically connected by the first connecting lines 11.

The second connecting lines 12 may be connected to the driving voltagesupply line EDL and the second pads PD2, and the driving voltage supplyline EDL and the second pads PD2 may be electrically connected by thesecond connecting lines 12.

The third connecting lines 13 may be connected to the driving circuitsGDC and the third pads PD3, and the driving circuits GDC and the thirdpads PD3 may be electrically connected by the third connecting lines 13.

The fourth connecting lines 14 may be connected to the common voltagesupply line ESL and the fourth pads PD4, and the common voltage supplyline ESL and the fourth pads PD4 may be electrically connected by thefourth connecting lines 14.

The fifth connecting lines 15 may be connected to the common voltagesupply line ESL and the fifth pads PD5, and the common voltage supplyline ESL and the fifth pads PD5 may be electrically connected by thefifth connecting lines 15.

The sixth connecting lines 16 may be connected to the common voltagesupply line ESL and the sixth pads PD6, and the common voltage supplyline ESL and the sixth pads PD6 may be electrically connected by thesixth connecting lines 16.

In some exemplary embodiments, at least some of the connecting lines(11, 12, 13, 14, 15, and 16) may include the same material as that ofthe first input electrode DE1 and the first output electrode SE1 of FIG.6 and may be disposed in the same layer as the first input electrode DE1and the first output electrode SE1 of FIG. 6. In an exemplaryembodiment, the fourth connecting lines 14, the fifth connecting lines15, and the sixth connecting lines 16 may include the same material asthat of the first input electrode DE1 and the first output electrode SE1of FIG. 6 and may be disposed in the same layer as the first inputelectrode DE1 and the first output electrode SE1 of FIG. 6, and thefirst connecting lines 11, the second connecting lines 12, and the thirdconnecting lines 13 may be disposed in the same layer as the scan linesGL and may include the same material as that of the scan lines GL, forexample.

The FPCB 500 may include the terminal portion CD, which is coupled tothe pad portion PD of the display panel DP, and the terminal portion CDmay include first terminals CD1, second terminals CD2, third terminalsCD3, fourth terminals CD4, the fifth terminals CD5, the sixth terminalsCD6, and the seventh terminals CD7.

The first terminals CD1 may be connected to the first pads PD1 via theanisotropic conductive film AD1. The first terminals CD1 may beconnected to the driver D-IC of FIG. 2 via first terminal lines 51 andmay receive data signals from the driver D-IC of FIG. 2.

The second terminals CD2 may be connected to the second pads PD2 via theanisotropic conductive film AD1. The second terminals CD2 may beelectrically connected to external circuits via second terminal lines 52and may receive control signals.

The third terminals CD3 may be connected to the third pads PD3 via theanisotropic conductive film AD1. The third terminals CD3 may beconnected to external circuits or external power sources via thirdterminal lines 53 and may receive driving voltages.

The fourth terminals CD4 may be connected to the fourth pads PD4 via theanisotropic conductive film AD1. The fourth terminals CD4 may beconnected to external circuits or external power sources via the fourthterminal lines 54 and may receive a common voltage.

The fifth terminals CD5 may be connected to the fifth pads PD5 via theanisotropic conductive film AD1. The fifth terminals CD5 may not beconnected to external circuits or the driver D-IC of FIG. 2. That is,the fifth terminals CD5 may be dummy terminals and may be coupled to thefifth pads PD5 for improving a coupling force, but not to any particularterminal lines.

The sixth terminals CD6 may be connected to the sixth pads PD6 via theanisotropic conductive film AD1. The sixth terminals CD6 may beindentation terminals for inspecting indentations or conductive balls.The sixth terminals CD6 may not be connected to any particular terminallines.

The seventh terminals CD7 may be connected to the seventh pads PD7 viathe anisotropic conductive film AD1. The seventh terminals CD7 may bealignment terminals that are aligned with the seventh pads PD7.

The seventh terminals CD7 may include first terminal portions CD7 aextending in the second direction y and second terminal portions CD7 bconnected to the first terminal portions CD7 a and extending in thefirst direction x, particularly, in the direction opposite to thedirection in which the second pad portions PD7 b extend. The firstterminal portions CD7 a may be connected directly to the sixth terminalsCD6. When the seventh terminals CD7 and the seventh pads PD7 arealigned, the first terminal portions CD7 a may overlap with the firstpad portions PD7 a, but the second terminal portions CD7 b may notoverlap with the first pad portions PD7 a and the second pad portionsPD7 b. In some exemplary embodiments, the seventh terminals CD7 and theseventh pads PD7 may be aligned to form cross shapes.

In some exemplary embodiments, the seventh terminals CD7 may not beconnected to any particular terminal lines.

Referring to FIG. 13, the fifth pads PD5, which are dummy pads, thesixth pads PD6, which are indentation pads, and the seventh pads PD7,which are alignment pads, may be disposed closer than other signal pads(e.g., the fourth pads PD4), to which voltages or signals for drivingthe display panel DP are provided, to the edges ED of the display panelDP. Thus, static electricity ES is more likely to be introduced into thefifth pads PD5, the sixth pads PD6, and the seventh pads PD7 than intothe fourth pads PD4.

In a case where the static electricity ES is introduced into the fifthpads PD5, the sixth pads PD6, and the seventh pads PD7, the staticelectricity ES may move to other signal pads, for example, to the fourthsignal pads PD4, thereby causing damage to signal lines such as thefourth connecting lines 14.

Since the fifth pads PD5, the sixth pads PD6, and the seventh pads PD7are electrically connected to the common voltage supply line ESL, thestatic electricity ES introduced into the fifth pads PD5, the sixth padsPD6, and the seventh pads PD7 may be distributed to the common voltagesupply line ESL. That is, the common voltage supply line ESL may serveas an electrostatic dispersion line for distributing the staticelectricity ES introduced into the fifth pads PD5, the sixth pads PD6,and the seventh pads PD7. Accordingly, signal pads and signal lines maybe prevented from being damaged by the static electricity ES introducedinto the fifth pads PD5, the sixth pads PD6, and the seventh pads PD7,and the reliability of the display device 1 may be improved.

FIG. 14 is a plan view illustrating the touch sensing layer of thedisplay device of FIG. 1, FIG. 15 is an enlarged plan view of a part Q3of FIG. 14, FIG. 16 is a cross-sectional view, taken along line X13-X13′of FIG. 15, of the touch sensing layer of the display device of FIG. 1,FIG. 17 is a cross-sectional view, taken along line X15-X15′ of FIG. 15,of the touch sensing layer of the display device of FIG. 1, FIG. 18 is aplan view illustrating a part Q5 of FIG. 14 to show the path of movementof static electricity introduced from the outside of the display deviceof FIG. 1, FIG. 19 is a cross-sectional view, taken along line X17-X17′of FIG. 18, of the touch sensing layer of the display device of FIG. 1,FIG. 20 is a plan view illustrating a modified example of the part Q5 ofFIG. 18, and FIG. 21 is a plan view illustrating another modifiedexample of the part Q5 of FIG. 18.

Referring to FIGS. 14 through 21, the touch sensing layer 300 isdisposed on the second substrate 210.

In the touch sensing layer 300, a sensing area SA and a peripheral areaNSA are defined. The sensing area SA may be an area that may detecttouch input, and the peripheral area NSA may be an area that cannotdetect touch input.

The sensing area SA and the peripheral area NSA may correspond to thedisplay area DA and the non-display area NDA, respectively, of thedisplay device 1 of FIG. 1 or 4. In some exemplary embodiments, thesensing area SA may be substantially the same as the display area DA.

In the sensing area SA, first electrode portions 310 and secondelectrode portions 330 may be disposed on the second substrate 210.

In the peripheral area NSA, the touch pad portion TPAD, touch signallines (351, 353, and 355), and an electrostatic discharge portion 370may be disposed on the second substrate 210.

The sensing area SA will hereinafter be described.

The first electrode portions 310 and the second electrode portions 330,which are insulated from the first electrode portions 310, may bedisposed on the second substrate 210.

The first electrode portions 310 may extend in the first direction x. Aplurality of first electrode portions 310 may be provided and may bespaced apart from one another in the second direction y.

Each of the first electrode portions 310 may include a plurality offirst touch electrodes 311 arranged in the first direction x and firstconnectors 313 electrically connecting pairs of adjacent first touchelectrodes 311 in the first direction x. The term “connect” or“connection”, as used herein, encompasses physical and/or electricalconnection.

In some exemplary embodiments, the first touch electrodes 311 may have arhombic shape in a plan view, as illustrated in FIGS. 14 and 15, but theinvention is not limited thereto. That is, in other exemplaryembodiments, the first touch electrodes 311 may have various shapesother than a rhombic shape, such as a triangular, rectangular,pentagonal, circular, or bar shape, in a plan view.

The first touch electrodes 311 may include a transparent conductivematerial. In an exemplary embodiment, the transparent conductivematerial may be a conductive polymer such as silver nanowire (AgNW),indium tin oxide (“ITO”), indium zinc oxide (“IZO”), antimony zinc oxide(“AZO”), indium tin zinc oxide (“ITZO”), zinc oxide (ZnO), tin oxide(SnO₂), carbon nanotube (“CNT”), graphene, orpoly(3,4-ethylenedioxythiophene) (“PEDOT”), for example. When lighttransmittance is secured, the first touch electrodes 311 may include aconductive material such as a metal or an alloy thereof. Here, the metalmay be gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium(Cr), titanium (Ti), nickel (Ni), neodymium (Nd), Cu, or platinum (Pt).In some exemplary embodiments, when the first touch electrodes 311include a metal or an alloy thereof, the first touch electrodes 311 maybe provided into a mesh structure not to become visible to a user, inwhich case, the first touch electrodes 311 may be disposed not tooverlap with the light-emitting area PXA of FIG. 6.

The first connectors 313 may electrically connect the pairs of adjacentfirst touch electrodes 311 in the first direction x and may be incontact with the first touch electrodes 311. In some exemplaryembodiments, the first connectors 313 may be provided as bridge-shapeconnecting patterns. In some exemplary embodiments, the first connectors313 may be disposed in a different layer from the first touch electrodes311.

The first connectors 313 may include a conductive material. In someexemplary embodiments, the first connectors 313 may include a metal suchas Au, Ag, Al, Mo, Cr, Ti, Ni, Nd, Cu, or Pt or an alloy thereof. Insome exemplary embodiments, the first connectors 313 may have asingle-layer structure or a multilayer structure. In an exemplaryembodiment, the first connectors 313 may have a triple-layer structureof Ti/Al/Ti, for example.

FIGS. 14 through 16 illustrate that one first connector 313 is disposedbetween each pair of adjacent first touch electrodes 311 in the firstdirection x, but the number of first connectors 313 provided betweeneach pair of adjacent first touch electrodes 311 in the first directionx may vary. That is, two or more first connectors 313 may be disposedbetween each pair of adjacent first touch electrodes 311 in the firstdirection x.

In some exemplary embodiments, an insulating layer 320 may be disposedbetween the first touch electrodes 311 and the first connectors 313.That is, the first connectors 313 may be disposed on the secondsubstrate 210, the insulating layer 320 may be disposed on the firstconnectors 313, and the first touch electrodes 311 may be disposed onthe insulating layer 320. The first connectors 313 and the first touchelectrodes 311 may be connected through first contact holes CNT1 definedin the insulating layer 320.

The insulating layer 320 may include an insulating material. In someexemplary embodiments, the insulating material may be an inorganicinsulating material or an organic insulating material. In an exemplaryembodiment, the inorganic insulating material may include at least oneof aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, and hafnium oxide, for example. In an exemplaryembodiment, the organic insulating material may include at least one ofan acrylic resin, a methacrylic resin, polyisoprene, a vinyl resin, anepoxy resin, a urethane resin, a cellulose resin, a siloxane resin, apolyimide resin, a polyamide resin, and a perylene resin, for example.

The second electrode portions 330 may extend in the second direction y.A plurality of second electrode portions 330 may be provided and may bespaced apart from one another in the first direction x.

Each of the second electrode portions 330 may include a plurality ofsecond touch electrodes 331 arranged in the second direction y andsecond connectors 333 electrically connecting pairs of adjacent secondtouch electrodes 331 in the second direction y.

In some exemplary embodiments, the second touch electrodes 331 may bedisposed in the same layer as the first touch electrodes 311. In anexemplary embodiment, the second touch electrodes 331 may be disposed onthe insulating layer 320, for example. The second touch electrodes 331may have a rhombic shape in a plan view, but the invention is notlimited thereto. That is, the second touch electrodes 331 may havevarious shapes other than a rhombic shape, such as a triangular,rectangular, pentagonal, circular, or bar shape, in a plan view.

The second touch electrodes 331 may include a conductive material. Insome exemplary embodiments, the second touch electrodes 331 may includethe same material as that of the first touch electrodes 311.

The second connectors 333 may electrically connect the pairs of adjacentsecond touch electrodes 331 in the second direction y and may be incontact with the second touch electrodes 331. In some exemplaryembodiments, the second connectors 333 may be disposed in the same layeras the first touch electrodes 311 and the second touch electrodes 331.In an exemplary embodiment, the second connectors 333, like the firsttouch electrodes 311 and the second touch electrodes 331, may bedisposed on the insulating layer 320, for example.

In some exemplary embodiments, the second connectors 333 may beinsulated from the first connectors 313 or the first touch electrodes311 by the insulating layer 320. FIGS. 14, 15, and 17 illustrate thatthe second connectors 333 overlap with the first connectors 313, but theinvention is not limited thereto. In an alternative exemplaryembodiment, the second connectors 333 may overlap with the first touchelectrodes 311, but not with the first connectors 313.

The second connectors 333 may include the same material as that of thefirst touch electrodes 311 and the second touch electrodes 331.

In some exemplary embodiments, the first electrode portions 310 may bedriving electrode portions receiving driving signals for detecting thelocation of touch input, and the second electrode portions 330 may besensing electrode portions outputting sensing signals in response to thedriving signals.

The peripheral area NSA will hereinafter be described.

In the peripheral area NSA, the touch signal lines (351, 353, and 355)and the touch pad portion TPAD may be disposed on the second substrate210.

In an exemplary embodiment, the touch signal lines (351, 353, and 355)may include first touch signal lines 351, second touch signal lines 353,and third touch signal lines 355, for example. The first touch signallines 351 and the second touch signal lines 353 may be electricallyconnected to the first electrode portions 310, and the third touchsignal lines 355 may be electrically connected to the second electrodeportions 330.

In some exemplary embodiments, as illustrated in FIG. 14, first ends ofthe first touch signal lines 351 may be connected to first ends of thefirst electrode portions 310, and second ends of the first touch signallines 351 may be connected to the touch pad portion TPAD. Also, firstends of the second touch signal lines 353 may be connected to secondends of the first electrode portions 310, and second ends of the secondtouch signal lines 353 may be connected to the touch pad portion TPAD.

That is, the touch signal lines connected to the first electrodeportions 310 may be configured into a double routing structure, and as aresult, RC delays that may be caused by the resistances of the firstelectrode portions 310 may be improved. In some exemplary embodiments,the first ends of the first electrode portions 310 may be connected tothe first touch signal lines 351 through the insulating layer 320, andthe second ends of the first electrode portions 310 may be connected tothe second touch signal lines 353 through the insulating layer 320.

First ends of the third touch signal lines 355 may be electricallyconnected to the second electrode portions 330, and second ends of thethird touch signal lines 355 may be electrically connected to the touchpad portion TPAD. In some exemplary embodiments, first ends of thesecond electrode portions 330 may be connected to the third touch signallines 355 through the insulating layer 320. In an exemplary embodiment,the second electrode portions 330 may be connected to the third touchsignal lines 355 through second contact holes CNT2 defined in theinsulating layer 320, for example.

In some exemplary embodiments, the first touch signal lines 351, thesecond touch signal lines 353, and the third touch signal lines 355 mayinclude the same material as that of the first connectors 313 and may bedisposed in the same layer as the first connectors 313. In an exemplaryembodiment, the first touch signal lines 351, the second touch signallines 353, and the third touch signal lines 355 may be disposed betweenthe second substrate 210 and the insulating layer 320, for example.

In the peripheral area NSA, the touch pad portion TPAD may be disposedon the second substrate 210 and may be connected to the touch signallines (351, 353, and 355). The touch pad portion TPAD may include touchpads (not illustrated) connected to the touch signal lines (351, 353,and 355).

As already mentioned above, the touch pad portion TPAD may be connectedto the touch terminal portion TCD of the touch FPCB 700 via theanisotropic conductive film AD2 (refer to FIG. 3).

In the peripheral area NSA, the electrostatic discharge portion 370 maybe disposed on the second substrate 210. The electrostatic dischargeportion 370 may be spaced apart from the touch signal lines (351, 353,and 355) and may be disposed closer than the touch signal lines (351,353, and 355) to the edges of the second substrate 210. In other words,the touch signal lines (351, 353, and 355) may be disposed between thesensing area SA and the electrostatic discharge portion 370.

In some exemplary embodiments, the electrostatic discharge portion 370may be substantially in the form of a loop with one side opened and mayextend along all the edges of the second substrate 210, except for theedge corresponding to the touch pad portion TPAD, to surround the touchsignal lines (351, 353, and 355).

Since the electrostatic discharge portion 370 is disposed on the outsideof the touch signal lines (351, 353, and 355), static electricity ES maybe prevented from being introduced into the touch signal lines (351,353, and 355), and as a result, damage to the touch signal lines (351,353, and 355) may be prevented.

The electrostatic discharge portion 370 may include a conductivematerial. In some exemplary embodiments, the electrostatic dischargeportion 370, like the first touch signal lines 351, the second touchsignal lines 353, and the third touch signal lines 355, may include thesame material as that of the first connectors 313 and may be disposed inthe same layer as the first connectors 313. In some exemplaryembodiments, the electrostatic discharge portion 370 may not overlapwith the first touch signal lines 351, the second touch signal lines353, and the third touch signal lines 355 in a plan view.

In some exemplary embodiments, the electrostatic discharge portion 370may be in a state of not being provided with any particular signals orvoltages, i.e., in a floating state.

The electrostatic discharge portion 370 may include a plurality ofconductive patterns 371 spaced apart from one another. In some exemplaryembodiments, the conductive patterns 371 may be spaced apart from oneanother in the first and second directions x and y.

In some exemplary embodiments, a width W1, in the first direction x, ofthe conductive patterns 371 and a width W2, in the second direction y,of the conductive patterns 371 may be about 25 micrometers (μall) toabout 35 μm, and a distance D between the conductive patterns 371 may beabout 3 μm to about 5 μm, for example.

Since the electrostatic discharge portion 370 includes the conductivepatterns 371, which are spaced apart from one another, the staticelectricity ES is highly likely to be discharged in one of theconductive patterns 371, rather than arriving at the touch signal lines(351, 353, and 355). Accordingly, the touch signal lines (351, 353, and355) may be prevented from being damaged by the static electricity ES.

In some exemplary embodiments, the conductive patterns 371 may have arectangular shape in a plan view, as illustrated in FIG. 18, but theinvention is not limited thereto. In an alternative exemplaryembodiment, the conductive patterns 371 may have another polygonal shapesuch as a triangular, pentagonal, or hexagonal shape in a plan view.

The planar shape of the conductive patterns 371 is not particularlylimited, but may vary.

In an exemplary embodiment, as illustrated in FIG. 20, conductivepatterns 371 a may have a circular shape (or an elliptical shape) in aplan view, for example. Also, for example, as illustrated in FIG. 21,conductive patterns 371 b may be provided as stripes.

While the invention has been particularly illustrated and described withreference to exemplary embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the invention as defined by the following claims. The exemplaryembodiments should be considered in a descriptive sense only and not forpurposes of limitation.

What is claimed is:
 1. A display device comprising: a first substrateincluding a display area and a non-display area, which is on a peripheryof the display area; a light-emitting element disposed on the firstsubstrate and in the display area; a display signal line which isdisposed on the first substrate and in the display area, extends in afirst direction, and transmits a signal to the light-emitting element; acommon voltage supply line disposed on the first substrate and in thenon-display area; a display pad disposed on the first substrate and inthe non-display area, and electrically connected to the display signalline; a dummy pad disposed on the first substrate and in the non-displayarea, and electrically connected to the common voltage supply line; anda circuit board coupled to the first substrate, wherein the dummy pad isdisposed closer than the display pad to edges of the first substrate ina second direction, which intersects the first direction, wherein thecircuit board includes a terminal line, a display terminal which iselectrically connected to the terminal line and is electricallyconnected to the display pad, and a dummy terminal which is notelectrically connected to the terminal line and is electricallyconnected to the dummy pad.
 2. The display device of claim 1, furthercomprising a second dummy pad which is disposed on the first substrateand in the non-display area, and electrically connected to the commonvoltage supply line, the second dummy pad being disposed closer than thefirst dummy pad to the edges of the first substrate in the seconddirection, wherein the circuit board further includes a second dummyterminal which is not electrically connected to the terminal line and iselectrically connected to the second dummy pad.
 3. The display device ofclaim 2, wherein the second dummy pad includes a conductive materialdefining a light-transmitting part inside.
 4. The display device ofclaim 1, further comprising: a second substrate disposed on the firstsubstrate, the second substrate including a sensing area and aperipheral area, which is on a periphery of the sensing area; and atouch sensing layer disposed on the second substrate.
 5. The displaydevice of claim 4, wherein the touch sensing layer comprises: a touchelectrode portion disposed in the sensing area, touch signal linesdisposed in the peripheral area and connected to the touch electrodeportion, and an electrostatic discharge portion disposed in theperipheral area and spaced apart from the touch signal lines.
 6. Thedisplay device of claim 5, wherein the touch signal lines are disposedbetween the sensing area and the electrostatic discharge portion.
 7. Thedisplay device of claim 6, wherein the electrostatic discharge portionincludes a plurality of conductive patterns spaced apart from oneanother.
 8. The display device of claim 5, wherein the touch signallines and the electrostatic discharge portion include the same materialand disposed in a same layer.
 9. The display device of claim 5, whereinthe touch electrode portion comprises first touch electrodes arrangedalong the first direction and electrically connected to one another inthe first direction and second touch electrodes arranged along thesecond direction and electrically connected to one another in the seconddirection, the first touch electrodes and the second touch electrodesare disposed in the same layer, and the electrostatic discharge portionis disposed in a different layer from the first touch electrodes and thesecond touch electrodes.
 10. The display device of claim 9, wherein thetouch sensing layer further comprises an insulating layer disposed onthe electrostatic discharge portion, and the first touch electrodes andthe second touch electrodes are disposed on the insulating layer. 11.The display device of claim 9, wherein the touch electrode portionfurther comprises first connectors connecting pairs of adjacent firsttouch electrodes in the first direction and second connectors connectingpairs of adjacent second touch electrodes in the second direction, thefirst connectors are disposed in a different layer from theelectrostatic discharge portion, and the second connectors are disposedin a same layer as the electrostatic discharge portion.
 12. A displaydevice comprising: a first substrate including a display area and anon-display area, which is on a periphery of the display area; alight-emitting element disposed on the first substrate and in thedisplay area; a second substrate disposed over the light-emittingelement, the second substrate including a sensing area and a peripheralarea which is on a periphery of the sensing area; and a touch sensinglayer disposed on the second substrate, wherein the touch sensing layercomprises: a touch electrode portion disposed in the sensing area, touchsignal lines disposed in the peripheral area and connected to the touchelectrode portion, a touch pad portion disposed in the peripheral, andan electrostatic discharge portion disposed in the peripheral area andspaced apart from the touch signal lines, wherein the touch signal linesare electrically connected to the touch pad portion, wherein theelectrostatic discharge portion is not electrically connected to thetouch pad portion, and wherein the touch signal lines are disposedbetween the sensing area and the electrostatic discharge portion. 13.The display device of claim 12, wherein the electrostatic dischargeportion is disposed to surround the sensing area and the touch signallines.
 14. The display device of claim 13, wherein the electrostaticdischarge portion includes a conductive material, and another conductivematerial is not interposed between the electrostatic discharge portionand edges of the second substrate.
 15. The display device of claim 13,wherein the electrostatic discharge portion has a line shape which isbent a plurality of times and both first end and second end of theelectrostatic discharge portion face the touch pad portion.
 16. Thedisplay device of claim 13, wherein a line width of the electrostaticdischarge portion is greater that line widths of the touch signal lines.17. The display device of claim 12, wherein the electrostatic dischargeportion includes a plurality of conductive patterns spaced apart fromone another.
 18. The display device of claim 12, wherein the touchsignal lines and the electrostatic discharge portion include the samematerial and disposed in a same layer.
 19. The display device of claim12, wherein the touch electrode portion comprises first touch electrodesarranged along the first direction and electrically connected to oneanother in the first direction and second touch electrodes arrangedalong the second direction and electrically connected to one another inthe second direction, the first touch electrodes and the second touchelectrodes are disposed in the same layer, and the electrostaticdischarge portion is disposed in a different layer from the first touchelectrodes and the second touch electrodes.
 20. The display device ofclaim 19, wherein the touch electrode portion further comprises firstconnectors connecting pairs of adjacent first touch electrodes in thefirst direction and second connectors connecting pairs of adjacentsecond touch electrodes in the second direction, the first connectorsare disposed in a different layer from the electrostatic dischargeportion, and the second connectors are disposed in a same layer as theelectrostatic discharge portion.